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Exploring Thermoelectric Transport Properties and Band Parameters of n-Type Bi2-xSbxTe3 Compounds Using the Single Parabolic Band Model
Linh Ba Vu, Soo-ho Jung, Jinhee Bae, Jong Min Park, Kyung Tae Kim, Injoon Son, Seungki Jo
J Powder Mater. 2024;31(2):119-125.   Published online April 30, 2024
DOI: https://doi.org/10.4150/jpm.2024.00045
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The n-type Bi2-xSbxTe3 compounds have been of great interest due to its potential to achieve a high thermoelectric performance, comparable to that of p-type Bi2-xSbxTe3. However, a comprehensive understanding on the thermoelectric properties remains lacking. Here, we investigate the thermoelectric transport properties and band characteristics of n-type Bi2-xSbxTe3 (x = 0.1 – 1.1) based on experimental and theoretical considerations. We find that the higher power factor at lower Sb content results from the optimized balance between the density of state effective mass and nondegenerate mobility. Additionally, a higher carrier concentration at lower x suppresses bipolar conduction, thereby reducing thermal conductivity at elevated temperatures. Consequently, the highest zT of ~ 0.5 is observed at 450 K for x = 0.1 and, according to the single parabolic band model, it could be further improved by ~70 % through carrier concentration tuning.
Articles
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Enhancement of Thermoelectric Performance in Spark Plasma Sintered p-Type Bi0.5Sb1.5Te3.0 Compound via Hot Isostatic Pressing (HIP) Induced Reduction of Lattice Thermal Conductivity
Soo-Ho Jung, Ye Jin Woo, Kyung Tae Kim, Seungki Jo
J Powder Mater. 2023;30(2):123-129.   Published online April 1, 2023
DOI: https://doi.org/10.4150/KPMI.2023.30.2.123
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  • 3 Citations
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High-temperature and high-pressure post-processing applied to sintered thermoelectric materials can create nanoscale defects, thereby enhancing their thermoelectric performance. Here, we investigate the effect of hot isostatic pressing (HIP) as a post-processing treatment on the thermoelectric properties of p-type Bi0.5Sb1.5Te3.0 compounds sintered via spark plasma sintering. The sample post-processed via HIP maintains its electronic transport properties despite the reduced microstructural texturing. Moreover, lattice thermal conductivity is significantly reduced owing to activated phonon scattering, which can be attributed to the nanoscale defects created during HIP, resulting in an ~18% increase in peak zT value, which reaches ~1.43 at 100°C. This study validates that HIP enhances the thermoelectric performance by controlling the thermal transport without having any detrimental effects on the electronic transport properties of thermoelectric materials.

Citations

Citations to this article as recorded by  
  • Exploring Thermoelectric Transport Properties and Band Parameters of n-Type Bi2-xSbxTe3 Compounds Using the Single Parabolic Band Model
    Linh Ba Vu, Soo-ho Jung, Jinhee Bae, Jong Min Park, Kyung Tae Kim, Injoon Son, Seungki Jo
    journal of Korean Powder Metallurgy Institute.2024; 31(2): 119.     CrossRef
  • Investigation of the Thermal-to-Electrical Properties of Transition Metal-Sb Alloys Synthesized for Thermoelectric Applications
    Jong Min Park, Seungki Jo, Sooho Jung, Jinhee Bae, Linh Ba Vu, Kwi-Il Park, Kyung Tae Kim
    journal of Korean Powder Metallurgy Institute.2024; 31(3): 236.     CrossRef
  • Enhancing Electrical Properties of N-type Bismuth Telluride Alloys through Graphene Oxide Incorporation in Extrusion 3D Printing
    Jinhee Bae, Seungki Jo, Kyung Tae Kim
    journal of Korean Powder Metallurgy Institute.2023; 30(4): 318.     CrossRef
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Investigation on Interfacial Microstructures of Stainless Steel/Inconel Bonded by Directed Energy Deposition of alloy Powders
Yeong Seong Eom, Kyung Tae Kim, Soo-Ho Jung, Jihun Yu, Dong Yeol Yang, Jungho Choe, Chul Yong Sim, Seung Jun An
J Korean Powder Metall Inst. 2020;27(3):219-225.   Published online June 1, 2020
DOI: https://doi.org/10.4150/KPMI.2020.27.3.219
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AbstractAbstract PDF

The directed energy deposition (DED) process of metal 3D printing technologies has been treated as an effective method for welding, repairing, and even 3-dimensional building of machinery parts. In this study, stainless steel 316L (STS316L) and Inconel 625 (IN625) alloy powders are additively manufactured using the DED process, and the microstructure of the fabricated STS316L/IN625 sample is investigated. In particular, there are no secondary phases in the interface between STS316L and the IN625 alloy. The EDS and Vickers hardness results clearly show compositionally and mechanically transient layers a few tens of micrometers in thickness. Interestingly, several cracks are only observed in the STS 316L rather than in the IN625 alloy near the interface. In addition, small-sized voids 200–400 nm in diameter that look like trapped pores are present in both materials. The cracks present near the interface are formed by tensile stress in STS316L caused by the difference in the CTE (coefficient of thermal expansion) between the two materials during the DED process. These results can provide fundamental information for the fabrication of machinery parts that require joining of two materials, such as valves.


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