kpmi
Articles
- Page Path
- HOME > J Korean Powder Metall Inst > Volume 15(2); 2008 > Article
- 경화촉매 분말의 입도조절 및 표면코팅에 의한 에폭시 레진 기반 혼합조성의 상온 보관특성 개선
- 이준식, 현창용, 이종현
- Improvement of Pot Life in the Epoxy Resin-based Adhesive Formulation by Size Control and Coating of Curing Accelerator Powders
- Jun-Sik Lee, Chang-Yong Hyun, Jong-Hyun Lee
-
Journal of Korean Powder Metallurgy Institute 2008;15(2):119-124
DOI: https://doi.org/10.4150/KPMI.2008.15.2.119
1한국생산기술연구원 정밀접합팀/마이크로조이닝센터
2서울산업대학교 신소재공학과
3서울산업대학교 신소재공학과
1Micro-Joining Center/Advanced Joining Technology Team, KITECH (Korea Institute of Industrial Technology)
2Department of Materials Science and Engineering, Seoul National University of Technology
3Department of Materials Science and Engineering, Seoul National University of Technology
2서울산업대학교 신소재공학과
3서울산업대학교 신소재공학과
1Micro-Joining Center/Advanced Joining Technology Team, KITECH (Korea Institute of Industrial Technology)
2Department of Materials Science and Engineering, Seoul National University of Technology
3Department of Materials Science and Engineering, Seoul National University of Technology
- 18 Views
- 1 Download
- 0 Crossref
- 0 Scopus
Abstract
To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.
Cited- Related articles
-
