Abstract

W-Cu alloy is attractive to thermal managing materials in microelectronic devices because of its good thermal properties. The metal injection molding (MIM) of W-Cu systems can satisfy the need for mass production of the complex shaped W-Cu parts in semiconductor devices. In this study, the application of MIM process of the mechanically alloyed (MA) W-Cu composite powders, which had higher sinterability were investigated. The MA W-Cu powders and reduction treated (RT) powders were injected by using of the multicomponent binder system. The multi-stage debinding cycles were adopted in N_2 and H_2 atmosphere. The isostatic repressing treatment was carried out in order to improve the relative density of brown parts. The brown part of RT W-Cu composite powder sintered at 1100°C had shown the higher sinterability compared to that of MA powder. The relative sintered density of all specimens increased to 96% by sintering at 1200°C for 1 hour. The relationship between green density and the sintering behavior of MA W-Cu composite powder was analyzed and discussed on the basis of the nanostructured characteristics of the MA W-Cu composite powder.