- Atomistic Simulation of Sintering Mechanism for Copper Nano-Powders
-
Yujin Seong, Sungwon Hwang, See Jo Kim, Sungho Kim, Seong-Gon Kim, Hak Jun Kim, Seong Jin Park
-
J Korean Powder Metall Inst. 2015;22(4):247-253. Published online August 1, 2015
-
DOI: https://doi.org/10.4150/KPMI.2015.22.4.247
-
-
221
View
-
3
Download
-
3
Citations
-
Abstract
PDF
The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.
-
Citations
Citations to this article as recorded by 
- Mesoscale modelling of polymer powder densification due to thermal sintering
Amine Bahloul, Issam Doghri, Laurent Adam Applied Mathematical Modelling.2023; 114: 408. CrossRef - Review of “Integrated Computer-Aided Process Engineering Session in the International Symposium on Innovation in Materials Processing (ISIMP, 26–29 October 2021)”
Hyunjoo Choi, Jungjoon Kim, Pil-Ryung Cha, Hyoung Seop Kim MATERIALS TRANSACTIONS.2023; 64(10): 2542. CrossRef - Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification
Eun Byeol Choi, Jong-Hyun Lee Applied Surface Science.2017; 415: 67. CrossRef
|