The microstructural properties and electrical characteristics of sputtering films deposited with a Cu-Ga target are analyzed. The Cu-Ga target is prepared using the cold spray process and shows generally uniform composition distributions, as suggested by secondary ion mass spectrometer (SIMS) data. Characteristics of the sputtered Cu-Ga films are investigated at three positions (top, center and bottom) of the Cu-Ga target by X-ray diffraction (XRD), SIMS, 4-point probe and transmission electron microscopy (TEM) analysis methods. The results show that the Cu-Ga films are composed of hexagonal and unknown phases, and they have similar distributions of composition and resistivity at the top, center, and bottom regions of the Cu-Ga target. It demonstrates that these films have uniform properties regardless of the position on the Cu-Ga target. In conclusion, the cold spray process is expected to be a useful method for preparing sputter targets.

This study manufactured a CIG-based composite coating layer utilizing a new warm spray process, and a mixed powder of Cu-20at.%Ga and Cu-20at.%In. In order to obtain the mixed powder with desired composition, the Cu-20at.%Ga and Cu-20at.%In powders were mixed with a 7:1 ratio. The mixed powder had an average particle size of 35.4 μm. Through the utilization of a warm spray process, a CIG-based composite coating layer of 180 μm thickness could be manufactured on a pure Al matrix. To analyze the microstructure and phase, the warm sprayed coating layer underwent XRD, SEM/EDS and EMPA analyses. In addition, to improve the physical properties of the coating layer, an annealing heat treatment was conducted at temperatures of 200°C, 400°C and 600°C for 1 hour each. The microstructure analysis identified α-Cu, Cu₄In and Cu₃Ga phases in the early mixed powder, while Cu₄In disappeared, and additional Cu₉In₄ and Cu₉Ga₄ phases were identified in the warm sprayed coating layer. Porosity after annealing heat treatment reduced from 0.75% (warm sprayed coating layer) to 0.6% (after 600°C/1 hr. heat treatment), and hardness reduced from 288 Hv to 190 Hv. No significant phase changes were found after annealing heat treatment.

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• Fabrication and Microstructure/Properties of Bulk-typeTantalum Material by a Kinetic Spray Process
  Ji-Hye Lee, Ji-Won Kim, Kee-Ahn Lee
  Journal of Korean Powder Metallurgy Institute.2016; 23(1): 8.     CrossRef
• Effect of Heat Treatment Environment on the Microstructure and Properties of Kinetic Sprayed Tantalum Coating Layer
  Ji-Hye Lee, Hyung-Jun Kim, Kee-Ahn Lee
  Journal of Korean Powder Metallurgy Institute.2015; 22(1): 32.     CrossRef