Cu-Mn compacts are fabricated by the pulsed current activated sintering method (PCAS) for sputtering target application. For fabricating the compacts, optimized sintering conditions such as the temperature, pulse ratio, pressure, and heating rate are controlled during the sintering process. The final sintering temperature and heating rate required to fabricate the target materials having high density are 700°C and 80°C/min, respectively. The heating directly progresses up to 700°C with a 3 min holding time. The sputtering target materials having high relative density of 100% are fabricated by employing a uniaxial pressure of 60 MPa and a sintering temperature of 700°C without any significant change in the grain size. Also, the shrinkage displacement of the Cu-Mn target materials considerably increases with an increase in the pressure at sintering temperatures up to 700°C.

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• Fabrication and Mechanical Property of Fe-20Cu-1C Compacts by SPS process with Different Heating Rate
  Jung-Han Ryu, Soo-Sik Shin, Byung-Rok Ryu, Kyung-Sik Kim, Jun-Ho Jang, Ik-Hyun Oh, Kap-Tae Kim, Hyun-Kuk Park
  Journal of Korean Powder Metallurgy Institute.2017; 24(4): 302.     CrossRef