This study investigates the effects of ultrasonic nanocrystal surface modification (UNSM) on the microstructural evolution and tribological performance of a three-dimensional interconnected heterostructured compositionally complex alloy fabricated by liquid metal dealloying (LMD). The as-LMD microstructure comprises an interconnected Cu-rich phase and a CoCrFe-rich ligament phase. Electron backscatter diffraction reveals pronounced severe plastic deformation near the surface after UNSM, characterized by subgrain formation and increased intragranular misorientation. The kernel average misorientation distribution reveals a pronounced depth-dependent deformation gradient, with dislocations preferentially accumulating at the interphase boundaries. Vickers hardness increases from approximately 100–120 HV in the as-LMD condition to greater than 270 HV at the surface after UNSM, and the hardening effect remains detectable to a depth of approximately 500 μm. Compressive residual stresses are concentrated within the surface-adjacent ~50 μm. The solid ligament phase exhibits higher compressive residual stress than the Cu-rich phase, reflecting phase-dependent deformation accommodation and stress partitioning. Reciprocating wear tests show a narrower wear track, a markedly reduced wear depth, and a lower and more stable friction coefficient after UNSM. Microscopy shows oxide-layer cracking and delamination in the as-LMD condition, whereas the UNSM-treated surface exhibits minor abrasive wear of the tribo-film without delamination.
Area-selective atomic layer deposition (AS-ALD) is a bottom-up process that selectively deposits thin films onto specific areas of a wafer surface. The surface reactions of AS-ALD are controlled by blocking the adsorption of precursors using inhibitors such as self-assembled monolayers (SAMs) or small molecule inhibitors. To increase selectivity during the AS-ALD process, the design of both the inhibitor and the precursor is crucial. Both inhibitors and precursors vary in reactivity and size, and surface reactions are blocked through interactions between precursor molecules and surface functional groups. However, challenges in the conventional SAM-based AS-ALD method include thermal instability and potential damage to substrates during the removal of residual SAMs after the process. To address these issues, recent studies have proposed alternative inhibitors and process design strategies.
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