The improvement of dispersion stability for the primary polishing slurry in a CMP process is achieved to prevent defects produced by agglomeration of the slurry. The dispersion properties are analyzed according to the physical characteristics of each silica sol sample. Further, the difference in the dispersion stability is confirmed as the surfactant content. The dispersibility results measured by Zeta potential suggest that the dispersion properties depend on the content and size of the abrasive in the primary polishing slurry. Moreover, the optimum ratio for high dispersion stability is confirmed as the addition content of the surfactant. Based on the aforementioned results, the long-term stability of each slurry is analyzed. Turbiscan analysis demonstrates that the agglomeration occurs depending on the increasing amount of surfactant. As a result, we demonstrate that the increased particle size and the decreased content of silica improve the dispersion stability and long-term stability.

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• Surface Defect Properties of Prime, Test-Grade Silicon Wafers
  Seung-Hwan Oh, Hyeonmin Yim, Donghee Lee, Dong Hyeok Seo, Won Jin Kim, Ryun Na Kim, Woo-Byoung Kim
  Korean Journal of Materials Research.2022; 32(9): 396.     CrossRef