Skip Navigation
Skip to contents

Journal of Powder Materials : Journal of Powder Materials

OPEN ACCESS
SEARCH
Search

Search

Page Path
HOME > Search
1 "Multi-layer materials"
Filter
Filter
Article category
Keywords
Publication year
Authors
Article
Article image
[Korean]
Thermal Properties of Diamond Aligned Electroless Ni Plating Layer/Oxygen Free Cu Substrates
Da-Woon Jeong, Song-Yi Kim, Kyoung-Tae Park, Seok-Jun Seo, Taek Soo Kim, Bum Sung Kim
J Korean Powder Metall Inst. 2015;22(2):134-137.   Published online April 1, 2015
DOI: https://doi.org/10.4150/KPMI.2015.22.2.134
  • 522 View
  • 1 Download
AbstractAbstract PDF

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and 50 μm are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to 150°C in all diamond size conditions. When the diamond particle size is increased from 15 μm to 50 μm (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.


Journal of Powder Materials : Journal of Powder Materials
TOP