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- The Effect of TiO2 Addition on Low-temperature Sintering Behaviors in a SnO2-CoO-CuO System
- Jae-Sang Lee, Kyung-Sik Oh, Yeong-Kyeun Paek
- J Powder Mater. 2024;31(2):146-151. Published online April 30, 2024
- DOI: https://doi.org/10.4150/jpm.2024.00024
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Abstract
PDF - Pure SnO2 has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO2 with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO2 have a porous microstructure, with a porosity of > 40%. In pure SnO2, a high sintering temperature of approximately 1300C is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO2, the compositions of the samples were Sn1-xTixO2-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO2, densification was shown to be improved when the samples were sintered at 950C. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950C.
- The Effect of SnO2 Addition on Sintering Behaviors in a Titanium Oxide-Copper Oxide System
- Ju-Won Lee, Kyung-Sik Oh, Tai-Joo Chung, Yeong-Kyeun Paek
- J Powder Mater. 2022;29(5):357-362. Published online October 1, 2022
- DOI: https://doi.org/10.4150/KPMI.2022.29.5.357
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Abstract
PDF
The low-temperature sinterability of TiO2-CuO systems was investigated using a solid solution of SnO2. Sample powders were prepared through conventional ball milling of mixed raw powders. With the SnO2 content, the compositions of the samples were Ti1-xSnxO2-CuO(2 wt.%) in the range of x ≤ 0.08. Compared with the samples without SnO2 addition, the densification was enhanced when the samples were sintered at 900°C. The dominant mass transport mechanism seemed to be grain-boundary diffusion during heat treatment at 900°C, where active grain-boundary diffusion was responsible for the improved densification. The rapid grain growth featured by activated sintering was also obstructed with the addition of SnO2. This suggested that both CuO as an activator and SnO2 dopant synergistically reduced the sintering temperature of TiO2.
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