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2 "Taek Soo Kim"
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Investigation of Factors for Smartization of Ppuri Enterprises Based on the Smart Factory Status
Bo Kyung Kim, Sang Mok Lee, Tae Bum Kim, Taek Soo Kim, Chang Kyung Kim
J Powder Mater. 2022;29(2):166-175.   Published online April 1, 2022
DOI: https://doi.org/10.4150/KPMI.2022.29.2.166
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AbstractAbstract PDF

Ppuri or Root technology primarily includes technologies such as casting, mold, plastic working, welding, heat treatment and surface treatment. It is regarded as an essential element for improving the competitiveness of the quality of final products. This study investigates the current status of smart factory implementation for Ppuri companies and analyzes the influencing relationships among various company factors. The factors affecting smart factory implementation for Ppuri companies are sales, exports, number of technical employees, and holding corporate research institutes. In addition, this research shows that even if smart factory implementation is pursued for data collection, data utilization is not implemented properly. Thus, it is suggested that the implementation of smart factories requires not only the availability of facilities and systems but also proper data utilization.

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Thermal Properties of Diamond Aligned Electroless Ni Plating Layer/Oxygen Free Cu Substrates
Da-Woon Jeong, Song-Yi Kim, Kyoung-Tae Park, Seok-Jun Seo, Taek Soo Kim, Bum Sung Kim
J Korean Powder Metall Inst. 2015;22(2):134-137.   Published online April 1, 2015
DOI: https://doi.org/10.4150/KPMI.2015.22.2.134
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The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and 50 μm are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to 150°C in all diamond size conditions. When the diamond particle size is increased from 15 μm to 50 μm (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.


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