Abstract

P/M coppers are subjected to the isothermal compression tests at the strain rate ranging from 0.01 to 10.0 s-1 and the temperature from 200 to 800°C. The processing map reveals the dynamic recrystallization (DRX) domain in the following temperature and strain rate ranges: 600-800°C and 0.01-10.0 s-1, respectively. In the domain, the region at temperature of 600°C and strain rate of 10-2s-1 shows peak efficiency. From the kinetic analysis, the apparent activation energy in the DRX domain is 190.67 kJ/mol and it suggests that lattice self-diffusion is the rate controlling mechanism.

• Keywords: Pure copper;Warm working;Processing map;Dynamic recrystallization;