Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn–Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m⁻¹K⁻¹ was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10⁻⁶ to 3.06 × 10⁻⁶ K⁻¹. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

In this study, the electroless nickel plating method has been investigated for the coating of Ni nanoparticles onto fine Al powder as promising energetic materials. The adsorption of nickel nanoparticles onto the surface of Al powders has been studied by varying various process parameters, namely, the amounts of reducing agent, complexing agent, and pH-controller. The size of nickel nanoparticles synthesized in the process has been optimized to approximately 200 nm and they have been adsorbed on the Al powder. TGA results clearly show that the temperature at which oxidation of Al mainly occurs is lowered as the amount of Ni nanoparticles on the Al surface increases. Furthermore, the Ni-plated Al powders prepared for all conditions show improved exothermic reaction due to the selfpropagating high-temperature synthesis (SHS) between Ni and Al. Therefore, Al powders fully coated by Ni nanoparticles show the highest exothermic reactivity: this demonstrates the efficiency of Ni coating in improving the energetic properties of Al powders.

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  Aerospace.2023; 10(10): 878.     CrossRef
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  Minerals.2023; 13(2): 133.     CrossRef
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  Soo-ho Jung, Kyung Tae Kim, Jinhee Bae, Yoon Jeong Choi, Jae Min Kim, Jeong-Yun Sun
  Materials Letters.2023; 351: 135009.     CrossRef
• High energy Al@Ni preparation of core-shell particles by adjusting nickel layer thickness
  Yongpeng Chen, Jianguo Zhang, Jiawei Zhu, Ning Xiang, Huichao Zhang, Zunning Zhou
  Vacuum.2022; 205: 111344.     CrossRef
• Electroless deposition of Ni nanoparticles on micron-sized boron carbide particles: Physicochemical and oxidation properties
  Prashant Ravasaheb Deshmukh, Hyung Soo Hyun, Youngku Sohn, Weon Gyu Shin
  Korean Journal of Chemical Engineering.2020; 37(3): 546.     CrossRef
• Synthesis and exothermic reactions of ultra-fine snowman-shaped particles with directly bonded Ni/Al interfaces
  Gu Hyun Kwon, Kyung Tae Kim, Dong Won Kim, Jungho Choe, Jung Yeul Yun, Jong-Man Kim
  Applied Surface Science.2019; 476: 481.     CrossRef

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and 50 μm are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to 150°C in all diamond size conditions. When the diamond particle size is increased from 15 μm to 50 μm (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.