Department of Mechanical Engineering, Pohang University of Science and Engineering (POSTECH), Pohang 790-784, Korea
a GTC, Samsung Electronics Co., Ltd., Suwon 443-742, Korea
© The Korean Powder Metallurgy Institute. All rights reserved.
Property | PW | PP | PE | SA |
---|---|---|---|---|
|
||||
Density (g/cm3) | 0.92 | 0.92 | 0.93 | 0.95 |
Melting temperature (°C) | 51 | 78 | 120 | 53 |
Decomposition temperature (°C) | 242-280 | 464-481 | 464-471 | 246-275 |
Injection molded | Solvent debound | Debound PW | |
---|---|---|---|
|
|||
Mass (g) | 2.92 | 2.58 | 0.34 (86 % of total PW) |
Injection molded | Solvent debound | Thermal debound | Debound binder | |
---|---|---|---|---|
|
||||
Mass (g) | 2.92 | 2.58 | 2.28 | 0.64 (99.6 % of total binder) |
Property | PW | PP | PE | SA |
---|---|---|---|---|
|
||||
Density (g/cm3) | 0.92 | 0.92 | 0.93 | 0.95 |
Melting temperature (°C) | 51 | 78 | 120 | 53 |
Decomposition temperature (°C) | 242-280 | 464-481 | 464-471 | 246-275 |
Injection molded | Solvent debound | Debound PW | |
---|---|---|---|
|
|||
Mass (g) | 2.92 | 2.58 | 0.34 (86 % of total PW) |
Injection molded | Solvent debound | Thermal debound | Debound binder | |
---|---|---|---|---|
|
||||
Mass (g) | 2.92 | 2.58 | 2.28 | 0.64 (99.6 % of total binder) |