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Aluminum alloys, known for their high strength-to-weight ratios and impressive electrical and thermal conductivities, are extensively used in numerous engineering sectors, such as aerospace, automotive, and construction. Recently, significant efforts have been made to develop novel aluminum alloys specifically tailored for additive manufacturing. These new alloys aim to provide an optimal balance between mechanical properties and thermal/ electrical conductivities. In this study, nine combinatorial samples with various alloy compositions were fabricated using direct energy deposition (DED) additive manufacturing by adjusting the feeding speeds of Al6061 alloy and Al-12Si alloy powders. The effects of the alloying elements on the microstructure, electrical conductivity, and hardness were investigated. Generally, as the Si and Cu contents decreased, electrical conductivity increased and hardness decreased, exhibiting trade-off characteristics. However, electrical conductivity and hardness showed an optimal combination when the Si content was adjusted to below 4.5 wt%, which can sufficiently suppress the grain boundary segregation of the α- Si precipitates, and the Cu content was controlled to induce the formation of Al2Cu precipitates.
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Aluminum alloys are widely utilized in diverse industries, such as automobiles, aerospace, and architecture, owing to their high specific strength and resistance to oxidation. However, to meet the increasing demands of the industry, it is necessary to design new aluminum alloys with excellent properties. Thus, a new method is required to efficiently test additively manufactured aluminum alloys with various compositions within a short period during the alloy design process. In this study, a combinatory approach using a direct energy deposition system for metal 3D printing process with a dual feeder was employed. Two types of aluminum alloy powders, namely Al6061 and Al-12Cu, were utilized for the combinatory test conducted through 3D printing. Twelve types of Al-Si-Cu-Mg alloys were manufactured during this combinatory test, and the relationship between their microstructures and properties was investigated.
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High-entropy alloys (HEAs) are attracting attention because of their excellent properties and functions; however, they are relatively expensive compared with commercial alloys. Therefore, various efforts have been made to reduce the cost of raw materials. In this study, MIM is attempted using coarse equiatomic CoCrFeMnNi HEA powders. The mixing ratio (powder:binder) for HEA feedstock preparation is explored using torque rheometer. The block-shaped green parts are fabricated through a metal injection molding process using feedstock. The thermal debinding conditions are explored by thermogravimetric analysis, and solvent and thermal debinding are performed. It is densified under various sintering conditions considering the melting point of the HEA. The final product, which contains a small amount of non-FCC phase, is manufactured at a sintering temperature of 1250°C.
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Aluminum alloys are extensively employed in several industries, such as automobile, aerospace, and architecture, owing to their high specific strength and electrical and thermal conductivities. However, to meet the rising industrial demands, aluminum alloys must be designed with both excellent mechanical and thermal properties. Computer-aided alloy design is emerging as a technique for developing novel alloys to overcome these trade-off properties. Thus, the development of a new experimental method for designing alloys with high-throughput confirmation is gaining focus. A new approach that rapidly manufactures aluminum alloys with different compositions is required in the alloy design process. This study proposes a combined approach to rapidly investigate the relationship between the microstructure and properties of aluminum alloys using a direct energy deposition system with a dual-nozzle metal 3D printing process. Two types of aluminum alloy powders (Al-4.99Si-1.05Cu-0.47Mg and Al-7Mg) are employed for the 3D printing-based combined method. Nine types of Al-Si-Cu-Mg alloys are manufactured using the combined method, and the relationship between their microstructures and properties is examined.
This study investigates the interfacial reaction between powder-metallurgy high-entropy alloys (HEAs) and cast aluminum. HEA pellets are produced by the spark plasma sintering of Al0.5CoCrCu0.5FeNi HEA powder. These sintered pellets are then placed in molten Al, and the phases formed at the interface between the HEA pellets and cast Al are analyzed. First, Kirkendall voids are observed due to the difference in the diffusion rates between the liquid Al and solid HEA phases. In addition, although Co, Fe, and Ni atoms, which have low mixing enthalpies with Al, diffuse toward Al, Cu atoms, which have a high mixing enthalpy with Al, tend to form Al–Cu intermetallic compounds. These results provide guidelines for designing Al matrix composites containing high-entropy phases.
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The CoCrFeMnNi high-entropy alloy (HEA), which is the most widely known HEA with a single facecentered cubic structure, has attracted significant academic attention over the past decade owing to its outstanding multifunctional performance. Recent studies have suggested that CoCrFeMnNi-type HEAs exhibit excellent printability for selective laser melting (SLM) under a wide range of process conditions. Moreover, it has been suggested that SLM can not only provide great topological freedom of design but also exhibit excellent mechanical properties by overcoming the strength–ductility trade-off via producing a hierarchical heterogeneous microstructure. In this regard, the SLM-processed CoCrFeMnNi HEA has been extensively studied to comprehensively understand the mechanisms of microstructural evolution and resulting changes in mechanical properties. In this review, recent studies on CoCrFeMnNi-type HEAs produced using SLM are discussed with respect to process-induced microstructural evolution and the relationship between hierarchical heterogeneous microstructure and mechanical properties.
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